JPH0430746U - - Google Patents
Info
- Publication number
- JPH0430746U JPH0430746U JP7183790U JP7183790U JPH0430746U JP H0430746 U JPH0430746 U JP H0430746U JP 7183790 U JP7183790 U JP 7183790U JP 7183790 U JP7183790 U JP 7183790U JP H0430746 U JPH0430746 U JP H0430746U
- Authority
- JP
- Japan
- Prior art keywords
- pad
- distance
- ceramic package
- pga type
- type ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7183790U JP2502535Y2 (ja) | 1990-07-04 | 1990-07-04 | Ｐｇａ型セラミックパッケ―ジ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7183790U JP2502535Y2 (ja) | 1990-07-04 | 1990-07-04 | Ｐｇａ型セラミックパッケ―ジ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0430746U true JPH0430746U (en]) | 1992-03-12 |
| JP2502535Y2 JP2502535Y2 (ja) | 1996-06-26 |
Family
ID=31609229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7183790U Expired - Lifetime JP2502535Y2 (ja) | 1990-07-04 | 1990-07-04 | Ｐｇａ型セラミックパッケ―ジ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2502535Y2 (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023170818A1 (ja) * | 2022-03-09 | 2023-09-14 | 日本電信電話株式会社 | Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール |
-
1990
- 1990-07-04 JP JP7183790U patent/JP2502535Y2/ja not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023170818A1 (ja) * | 2022-03-09 | 2023-09-14 | 日本電信電話株式会社 | Ｂｇａ高周波モジュール、ｂｇａ高周波モジュール用基板、および光通信モジュール |
| JPWO2023170818A1 (en]) * | 2022-03-09 | 2023-09-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2502535Y2 (ja) | 1996-06-26 |